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Guangzhou Qing Qin Yu Environmental Protection Technology Co., Ltd.

Sales Center: Room 1010, South Tower, Xindacheng Plaza, 27 Erheng Road, Shuiyin Road, Yuexiu District, Guangzhou

Tel: 020-38989165

Fax: 020-38989166

Contact: 13925069066 Wu Jingli

Email: 1272244869@QQ.COM

Mitengqi floor grinding machine manufacturer explains the causes of floor bubbles.

Release time:

2023-11-10 17:56

Floor grinding machine manufacturers explain that floor bubbling most commonly occurs on the first floor or in basements, though it occasionally happens even on the second floor and above. Typically, these bubbles are noticed shortly after construction—some epoxy floors laid in the morning already develop bubbles by afternoon. The bubbles start small but gradually grow larger over time, continuing to expand until they eventually stabilize at a certain size.
　　The higher the temperature, the more likely it is for blisters to form—and the faster they develop. Blisters can vary greatly in shape and size; some reach diameters of over 1 meter, with heights ranging from 20 to 50 millimeters. Interestingly, the occurrence of blisters doesn’t seem to be clearly linked to the construction site—some areas experience severe blistering, while others remain relatively unaffected, and some spots even retain their pristine condition. Even within the same work team, using identical materials on the same epoxy flooring system, some sections end up with blisters, while others stay intact. This suggests that blistering is caused by a combination of multiple factors. One issue that everyone is keen to understand is the root cause of these blisters. When a blister is carefully cut open, it’s revealed that the interior contains either water or a yellowish-brown liquid. Importantly, the epoxy flooring layer has completely detached from the substrate, leaving behind a honeycomb-like pattern where the adhesive material originally bonding the two layers has been pulled away. From a physics perspective, this phenomenon can be explained by the relationship between temperature and pressure along three distinct curves that define the saturation state of a liquid vaporizing inside a sealed container.
　　Floor grinding machine manufacturers analyze that the epoxy layer in areas without blistering is poorly bonded to the floor surface. Upon close inspection of the contact zones, unreacted, uncured areas are also evident—caused by moisture preventing the epoxy from fully curing. But where does this moisture come from? The primary sources include: 1. The substrate itself, such as cement mortar screeds, which can retain up to about 12% moisture—note that the substrate typically holds more water than the screed layer. 2. Residual dehydration within other ingredients mixed into the epoxy during preparation. 3. Poor adhesion between the epoxy and the substrate during application, leading to gaps; combined with the inherent chemical reactivity of the epoxy, some areas may remain partially uncured or fail to fully solidify due to exposure to moist air. 4. Moisture-laden gases seeping upward from underground through the substrate.